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|Thermally Robust Polymer Dielectric Systems for Air Force Wide- Temperature Power Electronics Applications|
|Keywords: polymer film, capacitor, high temperature|
|Thermally stable, mechanically robust, compact capacitors are the technology driver for high performance power systems. The increasing proximity of power electronics to heat sources demands that the current thermal load for electronic system cooling be reduced or even eliminated in new generation aircraft power systems. While aerospace power conditioning capacitor applications typically use polycarbonate (PC) dielectric films in wound capacitors for operation in the -55ºC to 125ºC range, there is a current need for high temperature polymer film dielectrics with dielectric stability in the -55ºC to 350ºC range. As part of our capacitor program toward meeting the objective of dielectric stability and reliability in capacitor devices at temperatures as high as 350ºC, we designed and evaluated high strength polymer films with high glass transition temperatures (375-450ºC) as well as high thermal stabilities (470-520ºC). The variable temperature dielectric properties of metallized thin films in the RT-350ºC range are reported for high temperature polymer systems such as fluorinated polybenzoxazoles (6F-PBO) and a fluorenyl polyester incorporating diamond-like hydrocarbon units, known as FDAPE. A comparative evaluation of the state-of-art fluorenyl polyester film FPE, with a glass transition temperature of 330ºC, has also been performed in the same temperature range. The main focus of the study is on wide temperature dielectric measurements of film capacitance, dissipation factor as well as its insulation resistance and the effects of thermal cycling on polymer dielectric stability. Possible correlations between the thermo-mechanical properties of the polymer films and their high temperature dielectric properties are also examined, from the viewpoint of their electro-mechanical stability for long term operation in Air Force wide temperature power electronics applications.|
University of Dayton Research Institute