Here is the abstract you requested from the HiTEN_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Operational and Performance Test Results of the Reconfigurable Processor for Data Acquisition (RPDA) at 250°C|
|Keywords: Processor, Reconfigurable, Test Results|
|This paper discusses the operational and performance test results of the Reconfigurable Processor for Data Acquistion (RPDA). The RPDA leverages advances in high temperature electronics for new applications and improved system performance. It incorporate a 250°C High Temperature (HT) SOI CMOS process technology, several new HT products, and HT package and assembly technology. The design integrates a HT FPGA, SRAM and EEPROM into a Multi-Chip Module (MCM) creating a flexible, re-configurable computing platform for sensor data processing and control applications at 250oC. A reconfigurable processor enables the ability to gather information from multiple sources and then control multiple devices with a single electronics assembly while reducing size, weight and power. Packaged in a small 2.2 x 0.75 inch (56 x 18 mm) MCM, the module operates at clock rates up to 10MHz from a single 5V supply. Although power consumption is strongly dependent on configuration, the targeted demonstration configuration clocked at 1MHz power dissipation is on the order of 100mW. The combination of all these technologies and application code to operate the module provides a significant improvement over existing technology for data acquisition applications. Results of the RPDA development to be addressed include: • Final Package Configuration • Test Results of individual components within the RPDA • Write and Read to the EEPROM and SRAM • Load and boot the FPGA from the EEPROM • Control and Data Write and Read • Operating Speed • Power Consumption • EEPROM Refresh Timer operation • Performance of “in-package” heating element for test The combination of all these technologies and application code to operate the module provides a significant improvement over existing technology for high-temperature data acquisition applications.|
|Thomas Romanko, Applications Engineer