Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Characterization of Extent of Cure of Form-in-Place Compounds|
|Keywords: Form In Place Gasket, Material Properties, Cure Characterics|
|Form-In-Place (FIP) gasketing is particularly well suited to provide effective EMI shielding for wireless handsets, PDAs, PC cards, telecom base stations, and many other compartmentalized electronic assemblies. This method of gasketing provides effective cost savings in the form of raw materials, labor and assembly time. The elastomeric compounds can be engineered to have advanced electrical and/or thermal performance in addition to environment sealing. The performance of FIP gaskets is highly dependent on the cure rate and cure state of the silicone-based matrix. However, it is sometimes difficult to use traditional methods to characterize the extent of cure of such compounds, due to application differences and cure chemistry. In this study, we present easily understood methods to characterize the extent of cure of FIP compounds. The effect of temperature, humidity and time on the extent of cure has been extensively studied with these methods using high performance electrically conductive FIP elastomer gaskets as an example.|
|Hui Ye, Materials Scientist