Abstract Preview

Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Deposition of Thick Film Fine Line Patterns by Direct Writing
Keywords: thick film , paste deposition, direct writing
The process of the direct deposition of thick film materials (somewhere known writing) on ceramic and silicon substrates was investigated and some results are described in this paper. Such approach was chosen as a low cost and prompt alternative for deposition of thick film pastes, especially by low volume batches, for hybrid ICs, as well for non-conventional applications (for example for front side of solar cells, antennas, CSP interposers etc.). There at Brno University of Technology is developed reasonable equipment for direct writing deposition which basic characteristics may be included between dispensing and jetting technique parameters. This equipment consists from plotter drive unit with dispensing head which is situated beyond the x, y axis table, and control unit with software capable process CAD data. The substantial part of the head is z axis holder with syringe and dispensing nozzle. The paste is extruded through a hollow needle, working as a non contact dispense nozzle. Z axis motion is required that head moves down to paste transfer position, and after pattern completion move up in the starting position. Paste viscosity, pressure in cartridge, speed of the nozzle and distance between nozzle and substrate are the most important parameters to assure the optimal setting and paste transfer reproducibility. In more constant pressure, optional heating system and constant movement of either the needle or the substrate enables a uniform and homogeneous paste application. Various materials under various process conditions were applied to achieve favourable results with good reproducibility. Subsequently have been observed, measured and evaluated the shape of the deposited layer. Also electrical properties of the deposited conductor materials were evaluated. Results have shown that this process constitutes the flexible, reconfigurable and user-friendly technique to create various patterns without long set-up time. The direct write approach may be utilized to deposit a conventional thick film materials in the single layer of pattern or to sequentially stack layers of material to produce multilayer patterns. To reach necessary deposition process reproducibility with low cost is the main aim of this work. In this way we are investigating deposition of various types of pastes, as conductive as well dielectric and some special too. However any way there are two main topics leading to process optimizing: the equipment mechanical precision and definition of the optimal device settings for concrete type of materials, especially if it is needed resolution less the 100 m.
Ivan Szendiuch, Assoc. Professor
Brno University of Technology
Brno 602 00,
Czech Republic

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems