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Abstract Preview
Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
| Environmental Conditions Impacts on Pb-Free Solder Joint Reliability |
| Keywords: Pb-free solder, end use environmental conditions impact, reliability |
| Understanding the sensitivity of Pb-free solder joint reliability on various environmental conditions, such as corrosive gas, low temperature, and high humidity environment, becomes a critical topic while deploying Pb-free products in various markets and applications. In this study, several sets of test vehicles consisting of various types of packages are pretreated with corrosive gas, salt spray, low temperature storage, and humidity/temperature soak. They were then subjected to temperature cycle test to study their reliability. Test vehicles using eutectic Sn/Pb solder were also tested side-by-side with the Pb-free siblings. The results have shown, under certain conditions, these pre-treatments imposed detrimental effect on Pb-free solder’s reliability performance. In this paper, the extent of degradation, the microstructural evolutions, and dependency of the degradation on package types and solder alloys will be discussed. |
Bo Liu, Maufacturing Engineer
Cisco Systems, Inc.
San Jose, CA
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