Abstract Preview

Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Lead-Free Solder-Joint-Reliability Model Enhancement
Keywords: Acceleration model, Pb-free, Solder joint
Upon release of electronics products with lead-free (LF) solders starting in 2006 and driven by the EU's RoHS legislation, a few models have been in use by the electronics industry to predict the life of the LF solder joints under product-application conditions based on accelerated testing results. These models, including one published by HP in 2005, have proven to have shortcomings, resulting in any of three probable scenarios: (1) over-design for reliability, (2) earlier-than-predicted field failures, or (3) missed technology opportunities. We have devised an approach to develop and implement improved models for predicting LF solder joint life. This approach comprises: (1) comprehensive review of available published work to create a large data base of test results, (2) application of statistical techniques to analyze this large data base, and (3) the grouping of the data into clusters of comparable packaging attributes and test conditions. Using this new approach, a set of accurate models has been generated that significantly reduce the errors and uncertainties compared to earlier models, greatly enhancing HP's ability to accurately predict LF solder-joint life based on test data.
Jian Miremadi, Reliability Engineer
Hewlett-Packard Company
Palo Alto, CA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems