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Second Bond Stitch Width Model as a Trend Solution to Lead Width Reduction
Keywords: Wire Bonding, Fine pitch leads, Wire diameter reduction
A well known trend in the semiconductor industry is minimization while continuously increasing the number of Input Output (IO) connections. This continues trend introduces a new Wire bonding (WB) challenge in the 2nd bond arena referred as the 2nd bond stitch width. As the stitch width scale gets closer to the lead width the need to predict the 2nd bond width becomes crucial. In order to answer this new need a discrete JMP (ver.7.0) model for 2nd bond stitch width in correlation to the capillary dimensions and Wire Diameter (WD) is being introduced. Different designs with changing geometries were optimized, bonded, and measured for their stitch width response. Geometries such as: Hole (H), Chamfer Diameter (CD), Tip size (Tip), Face Angle (FA), Outer Radius (OR) and WD are part of the tested matrix. A verification test was conducted and custom capillary designs were produced based on a numerical formulation from the model in order to receive a specific stitch width. These capillary designs were bonded and measured in order to verify the credibility of the stitch width model. An important observation out of few interesting results showed, that the main contributors controlling the 2nd bond stitch width are the WD and Tip size. Additionally a stitch width formulation as a function of the main capillary geometries and WD is introduced.
Tomer Levinson, Process and Application Engineer
Kulicke & Soffa Bonding Tools
Yokneam Elite 20692,

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