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Ka-Band High Power Near Hermetic Package using Liquid Crystal Polymer
Keywords: High Power Package, Ka-band amplifier, Liquid Crystal Polymer
In this paper, we present the design and development of a Ka-band near hermetic package that can handle 10 Watt DC power dissipation using liquid crystal polymer. The package is designed using liquid crystal polymer (LCP) which is laminated onto a 12mm by 12mm copper heat spreader of 0.5 mm thick. The feedthrough of the package is designed in the multi-layer LCP film to provide a 50[ matched transition to a mother board. The Ka-band power amplifier used in the experiment is TriQuint TGA4505 amplifier. The experimental results demonstrate that with DC dissipation close to 10W, the channel temperature (Tch) is at 143.9XC within the safe operating range of 150XC. The Tch temperature is obtained using infrared thermal mapping technique with baseplate temperature at 80XC. Also the effect of using sparse corner via at the PCB level will also be presented. By eliminating the vias at the corners, the number of vias is decreased from 196 to 148, a 24.4% reduction. Our experimental results demonstrate that sparse via configuration yield similar thermal performance as full via one. Lastly, our experimental measurements of the package feedthru work in the Ka-band region. From 18 to 36GHz, the returns loss of the feedthru is below -18dB and the insertion loss is -0.6dB across the band. We demonstrate the development of a Ka-band 10 Watt package that has near hermetic sealing capabilities in liquid crystal polymer. At the meeting, we will report the package design and fabrication, thermal characterization and RF experimental results.
Cheng Chen, Graduate Student Researcher
University of California, Davis
Davis, CA


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