Abstract Preview

Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Comprehensive Multilayer Substrate Models for Co-Simulation of Power and Signal Integrity
Keywords: Physics-Based Models, Power Distribution Network, Co-simulation
The design and optimization of reliable and cost-effective high-speed interconnect systems at package and printed circuit board levels are challenging tasks given the complexity and the large number of design parameters that need to be taken into account for modelling a realistic scenario. Recently, the authors have been addressing this problem by working on the development and validation of physics-based interconnect models. These models describe the elements in terms of concise equivalent networks that rely primarily on analytical formulations. Vias are modelled by the parallel-plate impedance formulation describing the interaction between vias and power planes and capacitive elements to approximate the near fields surrounding vias. Traces are modelled as multiconductor transmission lines that are coupled to the vias by applying modal decomposition. The physics-based models have been incorporated into a general method to simulate multilayer boards having arbitrary via and trace configurations. Our approach has been successfully applied to link simulation and validated against numerical techniques and measurements up to 40 GHz. A notable improvement on the computation speed of over two orders of magnitude has been achieved when compared to other numerical techniques. In this paper, the method is reviewed and it is shown that it can be applied to simulate power distribution networks having arbitrary power via and plane configurations. It is also demonstrated that the method is general enough to handle indistinctively power and signal nets and that it is therefore suitable to co-simulate both power and signal integrity domains in a comprehensive and efficient manner. Different configurations are studied in this paper and the simulation results are compared with other numerical techniques in terms of accuracy and efficiency.
Renato Rimolo-Donadio, Scientific Research Assistant
Technical University of Hamburg-Harburg
Hamburg 21079,

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic