Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|TLS-Dicing - The Key to Higher Yield and Throughput for Thin Wafers|
|Keywords: Laserdicing, improved edge quality, yield enhancement|
|Thermal Laser Separation (TLS)-Dicing will be presented as an innovative alternative to known dicing technologies to increase yield and throughput in combination with excellent mechanical and electrical product properties and a minimal cost of ownership. After the basics, benefits and limits of the technology a comparison of TLS with other known (laser-) dicing-technologies will be presented, completed by a status report about the application results and the prototype system itself. TLS-Process uses very simple effects to separate brittle materials by thermal (heating by laser, immediately followed by a water-aerosol-cooling) induced mechanical stress. The heated material expands and pressure forces occur inside the heated zone, accompanied by tensile stress around the heated zone. The laser focus is directly followed by a cooling spot. Cooling the material means shrinking it – thus, within the cooled zone further tensile forces are induced. At the overlaying zone of tensile forces the crack will be drawn through the material. TLS-Dicing is applicable for Silicon as well as for GaAs, Silicon Carbide and other semiconductor materials. Due to TLS is a cleaving process the resulting edge has an excellent quality without chipping and micro cracks. A significantly higher mechanical breaking strength and a increased blocking voltage for vertical devices are the results. The resulting zero kerf after TLS-Dicing has the potential to reduce the street width and increases the yield. For the increasingly used thin wafers (100 ... 200 µm) TLS with a maximum speed of 300 mm/s is faster than any other dicing technology. TLS has the potential to be a real alternative for all known dicing technologies and might be an enabling technology for new products. TLS seems to be especially well suited for RFID, dies for 3D-stacking, flexible products (chip cards), MEMS, optical devices and thin dies like power devices or solar wafers.|
|Hans-Ulrich Zuehlke, Business Development Manager PV / Semi
Jenoptik Automatisierungstechnik GmbH