Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A New Technique for Testing Copper Stud Bumps|
|Keywords: Stud bumps, Pull, Bond testing|
|We describe a technique to evaluate stud bump pull strength where the bumps are made from copper. The method uses a DAGE 4000 bond tester equipped with a CBP100 load cell and customised jaws. Results show that the bond strength can be assessed reliably and reproducibly. Data will be presented showing the bond strength of particular examples and the types of failure mode. Evaluation of these bumps is an essential part of the quality assurance for the flip chip products in which they are used. Previously these stud bumps were made from gold and its softness precluded the use of pull. Only shear testing could be used. Pull would be the preferred technique as a simple tensile load is applied to the bond. The extra resilience of copper permits the use of pull jaws to grip the material and exert a load. It is possible that this technique might be extended to first ball bonds where copper is substituted for gold.|
Dage Precision Industries
Aylesbury, Buckinghamshire HP19 8RY,