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Multi-Components Integration in a SIP
Keywords: SIP, SMD, Package
Many domains turn to the use of SIP solutions for the realization of sub systems which need more control functions interfaces. Thanks to the upgrade of the operating frequency of electronics devices, SIPs become fast and very clever with a higher integration level. However, the integration of several components in a same SMD package constitutes a delicate operation for high frequency applications. Components with different nature and forms are integrated in a reduced space and the positioning of certain devices in the package must be considered to ensure the overall operating performances of the SIP. In this paper, some steps of the design, conception and manufacturing process of a SIP are detailed. The choice of a partial metallic package, the electronic system configuration and the integrated components natures are treated by considering the final environmental constraint of the SIP. The cavity of the package is studied to appreciate perturbations phenomena’s which can unsettle the SIP performances. Particular cavity comportment is studied in accordance with the positioning of a component. The impact of the presence and location of a QFN package in a SMD package is analyzed with the support of EM simulations to better understand the SIP implantation step.
Benoit Haent Jens, Student & RF Design Engineer
Vectrawave, IETR
Les Loges En Josas, Yvelines 78350,

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