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Reliability Evaluation of Lead-Free Solders for Automotive Applications
Keywords: lead-free solder, reliability, automotive application
Lead-free solder materials have been widely applied to automotive electronics due to ELV(End of Life Vehicles) legislation. High temperature solders have been recently adopted to the automotive electronics to cope with the harsh, high temperature environments of automotive engine room and under-hood. In the present research, thermal shock(TS) and accelerated thermal cycle(ATC) test was performed for high temperature lead-free solders to understand the failure mode for the high temperature solders. Sn3.5Ag, Sn0.7Cu, Sn-3.0Ag-0.5Cu and Sn5.0Sb solder balls were chosen for solder materials in this study. Sn37Pb was also used as a reference solder material for the reliability tests. Microstructural changes and bonding strengths were observed during the reliability test. Resistance changes were measured and compared with Sn37Pb. All solder balls remained intact after thermal cycle test with the range from -40 to 150. However, Ag3Sn and Cu6Sn5 IMC configurations grew gradually as the number of cycles increased, which decreased joining strength. Thermal shock test up to 1500, also, were performed to examine failure mechanism. Interfacial micro-crack propagation was the main failure mode for eutectic Sn3.5Ag solder ball while cohesive solder failure was the only failure mode for the eutectic Sn37Pb solder ball.
Yoonki Sa,
Korea Institute of Industrial Technology (KITECH)
Incheon 406-840,
S. Korea

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