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Effect of Vibration on Lead-Free Solder Joint Reliability Under Temperature Changes for Automotive Electronics
Keywords: lead-free solder, joint reliability , vibration
The exemption of ELV legislation for vehicle electronics will be expired in January 1st, 2011. Thus, lead-free solders have to be revaluated for automotive applications. Since automotive electronics near engine or under-hood are experienced vibration at high temperature during the operation of vehicles, the high temperature vibration factor should be considered for ensuring reliability of the lead-free solder joints. In the present research, effect of vibration on the solder interface of Sn3.5Ag, Sn0.7Cu, Sn5.0Sb, Sn-3.0Ag-0.5Cu solders was investigated under various isothermal and humidity conditions. BGA test coupons with 64 solder balls of 450 um were fabricated. Then the BGA test coupons were reflowed on daisy-chained PCBs. After reflow, vibration test in 3-axis was performed with frequency of 10~1,000 Hz. In situ resistance measurement was, also, conducted to examine the fracture time. Initial resistance values were measured about the range of 270~330 m and increased gradually as the number of cycles increased. BGA test coupon of Sn3.5Ag was weak against fracture, which was involved with the formation of relatively rigid Ag3Sn intermetallic compounds and microstructure of -Sn phases. Brittle fracture was dominant for all the lead-free solders but Sn37Pb. Details will be discussed.
Sehoon Yoo,
Korea Institute of Industrial Technology (KITECH)
Incheon 406-840,
S. Korea

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