Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|LCP Properties Ideal for Miniaturization Trend in Electronic Industry|
|Keywords: LCP, Air Cavity Package, MEMs|
|LCP (liquid crystal polymer) has been a key engineering thermoplastic polymer in the electronics industry for more than 20 years. LCP allows designers to make components with increasingly thin walls and complex geometries. Newer LCP grades have short-term temperature resistance up to 340C to allow lead-free reflow soldering, which helps molders meet standards and legislation such as RoHS and REACH on removal of harmful substances . The consumer electronics industry is currently under pressure to remove halogenated materials from their products. LCP is inherently flame resistant (UL94 V-0), without additives, and is halogen-free. This presentation will cover the key benefits of LCP and how these superior characteristics can be translated to improvements in design and functionality of air cavities packages. Presentation will conclude with information on new products and technologies. MOVED TO POSTER FROM ADVANCED MATERIALS PER Jianbiao (John) Pan 4-24-09 EMAIL.|
|Edson Ito, Vectra Technical Marketing