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HotPak: A Tool for Rapid Thermal Mapping & Leakage Power Analysis of Flip-Chip Packages
Keywords: computational analysis, chip thermal analysis, power mapping, power density
Recently the Semiconductor Packaging group at Sun Microsystems published a technique for rapid thermal mapping of flip chip microprocessor/ASIC packages using analytical spectral superposition techniques [1]. The primary focus of the current submission is to introduce a 100% pure Java application called HotPak, which embodies the analytical/computational engine from [1]. This software tool- which is expected to be made available to the thermal community under open source licensing, has several features including the following: (I) Multi-document interface so that multiple parallel analyses on die floorplans can be conducted simultaneously (II)Ability to specify geometries, material properties etc. in multiple units (III) Ability to specify TIM1/TIM2 material properties in tables or as specific values (IV) Support to read in die floorplans in native flattened format as provided by chip design teams (V) Visualization of floorplan, power distribution and power density distribution in color, with ability to adjust ranges of power/density of interest. Export of visuals as high quality JPGs (VI) Statistical characterization of the input floorplans to understand distributions of power and density over the die (VII) Rapid thermal mapping of the die and case temperatures, and case flux. (VIII) Visualization of die/case temperature and case flux distributions- including mouse gestures on the visualizations, and support for export of generated visualizations as high quality JPGs. (IX) Export of data in tabular form (for sources) and grid form for silicon reliability analysis (X) Sub-threshold leakage power analysis HotPak has impressive benchmarks- on a typical laptop computer it takes less than 5 mins to do a complete thermal simulation for a microprocessor/ASIC layout with 10,000+ blocks. Since it is written in Java, it works flawlessly on Windows, Linux and MacOS. The predictions from the underlying engine has been verified experimentally via rigorous testing as detailed in [1]. [1] A Fourier Series-Based Analytical Solution for Three-Dimensional Conjugate Heat Transfer Problems in Microprocessor Cooling. Ankireddi, S.; Pecavar, S., IEEE Transactions on Components and Packaging Technologies, Volume 31, Issue 2, June 2008 Page(s):461 - 468
Sai Ankireddi,
Sun Microsystems Inc.
Santa Clara, CA


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