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Design and Integration of a Planar EBG for UWB Applications
Keywords: SSN, EBG, Integration
Due to their efficiency in suppressing the propagation of simultaneous switching noise (SSN) between power and ground planes in electronic packages and PCBs, Electromagnetic Bandgap (EBG) structures have received widespread acceptance. Consequently, different configurations of EBGs (e.g., mushroom-type, planar and hybrid EBGs) have been developed. Although planar EBGs have already been extensively studied, the focus in most of the published work has been on suppressing SSN within a narrow band of frequencies. J. Choi et al. of Georgia Tech proposed an alternating-impedance EBG for ultra-wide band (UWB) applications. However, the impact of integrating this EBG on its noise suppression characteristics and on the performance of integrated components was not considered. Hence, the focus of this work is to study the impact of the interaction between a microstrip line and a two-layered planar EBG for UWB, WLAN, Bluetooth and UMTS applications. The EBG and the line were first separately modeled, designed and fabricated on different FR4 boards. The EBG has a size of 35mm2 and consists of an array of 3*3 patches. It was measured using a VNA and a -50 dB stopband bandwidth of 10 GHz (2 GHz to 12 GHz) was obtained. The microstrip line (width=0.18 mm, thickness=0.017 mm, length=30 mm) was also designed to operate within this frequency range. When integrated together on the same FR4 board, the microstrip line caused a reduction in the stopband bandwidth of the EBG. The EBG also caused resonances in the insertion loss of the transmission line. At the resonance frequencies, strong electromagnetic interaction occurs and much power is coupled away from the line into the cavity (e.g., at 5.6 GHz, 60% of power is lost from the line). To prevent such performance degradation after integration, EBGs should be designed under consideration of other components to be integrated in its immediate vicinity.
Ivan Ndip, Group Manager of RF & High-Speed System Design
Fraunhofer Institute for Reliability and Microintegration, IZM
Berlin 13355,

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