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Modeling and Analysis of a New Packaging Structure for Noise Isolation in Mixed-Signal Systems
Keywords: Mixed-Signal Systems, EMI, Noise Isolation
The integration of mixed-signal components on the same board or package requires the use of efficient noise isolation techniques to prevent electromagnetic interference (EMI) between the different groups of components. Amongst the noise isolation methods proposed so far, decoupling capacitors, split planes and Electromagnetic Bandgap (EBG) structures have received the most attention. Decoupling capacitors and the method of split planes are ineffective at frequencies above 1 GHz. Although EBGs are very effective over a wide range of frequencies, they have some disadvantages which limit their applications. For example; 1) They require periodically-arranged patches, vias and in some cases, surface mount capacitors/inductors. These components consume most of the board/package space and very little space is left for the placement and routing of the “actual” system components. 2) Transmission lines referenced to the patterned layers of EBGs suffer from return-path discontinuity problems, which severely degrade their electrical performance. In this work, we propose a novel planar noise isolation structure, the Interconnected Patch-Ring (IPR) structure, which is just as effective as EBGs in noise isolation, but also overcomes most of the limitations of EBGs. It consists of two large patches and very thin interconnected metal strips (or rings) around each patch. A combination of the capacitance from the patch and inductance from the rings is used to achieve the stopband characteristics and hence, noise suppression, within the desired frequency range. In addition to noise suppression, the IPR-structure has many advantages over EBGs and other noise isolation techniques. For example; 1) It enables a higher integration density, since it consumes very little package/board space. 2) It is very cost-effective, because neither vias, surface-mount components nor expensive lossy dielectrics are needed for noise isolation. Using modeling and simulation techniques, the effectiveness of the IPR structure for minimizing EMI will be demonstrated in this paper.
Ivan Ndip, Group Manager of RF & High-Speed System Design
Fraunhofer Institute for Reliability and Microintegration, IZM
Berlin 13355,
Germany


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