Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A Novel Green Process to Manufacture Ultra High Density Packaging Substrates|
|Keywords: Green Manufacturing, Packaging Substrate, Higj Density|
|Regarding green manufacturing, the production of PCB & IC substrate leaves a lot of issues in waste management. Not only in production line setting-up but also in routine operation, the management costs of harsh chemicals and poison wastes in the processes of PCB & IC substrate are huge. In this paper, we disclose an efficient production process which requires the least kind of chemicals and can recycles most of the solvent. Regarding the details, we integrate 3 evolutional processes in manufacturing of packaging substrate: metal lift-off, temporary wafer bonding and spin-on dielectric layer. In a pilot operation, the complete process of packaging substrates only requires 3 chemicals excluding a photoresist and a dielectric material. Despite improving the waste issues; our substrates still have excellent performance. Regarding high density routing, our substrate can fan out 3-rows flip chip bump array of 105 micrometer pitch in just one routing layer. It is much ahead of ITRS roadmap. In addition, thin thickness is another characteristic of our substrates. In a real case, the thickness of our 6-layer packaging substrates is just 80 micrometer. It is much thinner than the conventional packaging substrates. With the light and thin characteristics, therefore, our substrates can provide a lot of benefit for packaging of mobile electronics.|
|Chih-Kuang Yang, Project Manager
Hsinchu, Taiwan 300,