Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|New Methods for Mechanical Mating Characterization of Surface Mount Technology Card to Board Interconnections|
|Keywords: Mechanical , Mating, Characterization|
|Large scale system packaging density requirements continue to place increased demand on improving card to board interconnections in the areas of electrical performance as well as physical density. To address these needs, board to board assemblies with new high density, surface mount technology (SMT) waferized interconnect systems have been developed, along with new methods to assess their mating characteristics to ensure both sufficient initial mating as well as long-term connection reliability. Applying existing measurement devices, new methodologies are presented to record interconnection alignment and the stress in solder connections. Exploiting the physical construction of the interconnection system, analytical and experimental techniques are detailed to reveal how solder attach strength and connector mating strains can be coupled to predict SMT solder strains during the mating cycle as well as during package environmental stress testing. MOVED FROM SYSTEM PACKAGING TO HIGH PERFORMANCE BOARDS 5-4-09.|