Micross

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Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Laser Scribing of Copper/Low-k Dielectric Semiconductor Materials by Nanosecond and Ultrafast Pulsewidth Lasers
Keywords: Laser , Scribing, Dicing
The adoption of copper/low-k materials into semiconductor devices has created new challenges for mechanical dicing. Low-k dielectrics are less mechanically strong compared to SiO2, making these layers susceptible to chipping, cracking, and delamination during saw dicing. Laser scribing or dicing of these devices offers a possible solution. Because the absorption of laser energy is dependent on the materials and layer thicknesses in a semiconductor stack, careful selection of the laser parameters are important for laser processing. This presentation provides a comparison of laser processing of copper/Black Diamond low-k materials using nanosecond and ultrafast pulsewidth lasers. MOVED FROM SYSTEM PACKAGING TO FLIP CHIP & WAFER BUMPING 5-4-09.
Andy Hooper, Technologist
Electro Scientific Industries
Portland, OR


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