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Laser Scribing of Copper/Low-k Dielectric Semiconductor Materials by Nanosecond and Ultrafast Pulsewidth Lasers
Keywords: Laser , Scribing, Dicing
The adoption of copper/low-k materials into semiconductor devices has created new challenges for mechanical dicing. Low-k dielectrics are less mechanically strong compared to SiO2, making these layers susceptible to chipping, cracking, and delamination during saw dicing. Laser scribing or dicing of these devices offers a possible solution. Because the absorption of laser energy is dependent on the materials and layer thicknesses in a semiconductor stack, careful selection of the laser parameters are important for laser processing. This presentation provides a comparison of laser processing of copper/Black Diamond low-k materials using nanosecond and ultrafast pulsewidth lasers. MOVED FROM SYSTEM PACKAGING TO FLIP CHIP & WAFER BUMPING 5-4-09.
Andy Hooper, Technologist
Electro Scientific Industries
Portland, OR

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