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Room Temperature Wedge-Wedge Ultrasonic Bonding using Aluminum Coated Copper Wire
Keywords: wedge-wedge, wire bonding, copper wire
Room temperature wedge-wedge ultrasonic bonding of AlSi1 wires and wedge-wedge bonding of gold wires at elevated temperatures are well-established techniques. Recently, wedge-wedge bonding of gold wires at room temperature has been reported [1]. Certain applications do not allow the use of aluminum bonding or gold wires, however, and many times, it would be desirable to use copper wire. The purpose of our study is to evaluate the feasibility of wedge-wedge bonding using commercially available 25 µm copper wires with aluminum coating at room temperature. Bonding quality, reliability and aging resistance of the wire bonds have been investigated using standard wire pull tests immediately after bonding and after accelerated life tests, including temperature storage at 125 °C and 150 °C for 2000 hours. Using focused ion beam (FIB-) preparation and high resolution electron microscopy (SEM, TEM combined with EDX x-ray analysis), microstructure results of the Al-coating/ Cu wire interface as well as of the bonding interconnect formed between the coated wire and the gold metallization on LTCC substrate will be presented. These investigations provide background information regarding the binding mechanisms and material interactions, and contribute to assess and to avoid potential reliability risks. Due to the found advantageous bond processing behavior and increased reliability properties, our results indicate that room temperature wedge-wedge bonding of coated copper wires has a remarkable application potential, for instance in medical applications. It combines all known advantages of usual copper bonding like excellent contacting behavior, high reliability and favorable material price with the possibility of processing temperature-damageable components and considerable improved storage capability. Therefore, room temperature bonding using coated copper wire can also reduce cycle time, manufacturing and material costs and will be conducive to new products. Reference: [1] Rainer Dohle, Tobias Müller, Holger Schulze, and Eugen Milke, “Gold Wire for Room Temperature Wedge-Wedge Bonding”, Proceedings of the 41st International Symposium on Microelectronics, Providence, Rhode Island, November 2-6, 2008
Matthias Petzold, Head of Department
Fraunhofer IWMH
Halle/Saale, Sachsen-Anhalt D-06120,

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems