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A Case Study of The Impact of Fabrication Processes on PCB Broadband Electrical Characteristics
Keywords: adhesion promotion treatment, short pulse propagation, conductive loss
It is known that copper foil roughness, dielectric constant, and the loss tangent of materials are critical factors to high frequency electrical characteristics. These parameters are not constant but vary with frequency as well as the PCB fabrication processes. In this paper, we study the electrical impacts of prepreg moisture absorption and copper foil roughness imparted by the adhesion promotion treatment. The effects of prepreg moisture absorption were studied on five groups of PCBs. Each group consisted of laminated prepreg which had been stored in a humid environment for different period of time to simulate various prepreg storage conditions. The effects of adhesion promotion treatments on inner layer copper surfaces were examined in a separate experiment on four groups of PCBs. Each of them were treated using a specific adhesion promotion treatment prior to lamination. The broadband electrical characteristics of the PCBs were finally evaluated by Short Pulse Propagation test method.
Jason Lin,
Compeq Manufacturing Co., Ltd.
Lu Chu Hsiang, Taoyuan Hsien 33843,
Republic of China

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