Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermosonic Gold to Gold Interconnect (GGI) Flip Chip Bonding for 7mm2 Die|
|Keywords: flip chip, GGI, Thermosonic|
|Ultrasonic flip chip die attach has been used for RF, HBLED, and sensor device packaging for mobile products. Ultrasonic flip chip GGI bonding has allowed low cost device packaging and 50% to 70% reduction in final package form factor compared to wire bonding process. New markets for MEMs and Image sensors are also requiring low cost assembly techniques that reduce package form factor and provide strong metallurgical joining. Thermosonic GGI flip chip bonding is a flip chip bonding method using bond tool heating and ultrasonic power to bond the die. For large die thermosonic attach the bond tool amplitude becomes an important process control factor. The bond tool amplitude must be evenly distributed over a large area for large die sizes. Bond tool heating is used to assist with intermetallic diffusion (bump transfer) during the bonding process. Bond tool heating will reduce the bond profile load, power, and bonding times within limits. This paper will show the GGI bond profile relationship between bond profile amplitude, power, and temperature for 7mm2 devices. Die shear and bump transfer data is used to measure the flip chip bond performance. The analysis showing the bonding parameters influence mutually. These results can help build criteria for parameter match and optimization in flip chip bonding process.|
|Hidetoshi Horibe, Factory Automation Group Manager
Mount Prospect, IL