Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Analysis of MEMS Structure Sidewalls for Carbon and Fluorinated Residue with SEM, EDS and TSA|
|Keywords: MEMS, Reliability, Contamination|
|The transition of MEMS and MOEMS devices from the laboratory to laminate based (PCB), high-volume manufacturing is challenging. Devices now must be manufactured with low defect rates and high reliability. Micromanufacturing techniques used for deep reaction ion etching (DRIE) typically use Fluorine plasma chemistries and can leave fluorinated sidewall residues that may release in the form of flakes. Sidewall residues that release as flakes can interfere with moving parts in fluidic and optical pathways rendering the devices useless. A study of removal of sidewall residue from MEMS structures is underway utilizing cryogenic aerosol particles for physical and possibly chemical removal. Recent advancements in cryogenic aerosol based on Carbon Dioxide (CO2) gas are being investigated and removal mechanisms proposed for fluorinated residues. The addition of modifiers to the cryogenic aerosol, enabling removal of polymer residue is studied as a potential technology enhancement. The results of this study are quantified using a new Electron Dispersive Spectroscopy (EDS) technique, Trace Element Sensitivity Analysis (TSA) for chemical mapping of surfaces prior to and after cleaning. These techniques enable pinpointing contamination at levels that would be lost by conventional mapping techniques. It is capable of determining individual particle chemistry with excellent accuracy and traceability.|
|Lee Levine, Consultant
Process Solutions Consulting
New Tripoli, PA