Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermomechanical Finite Element Techniques in Multilayer Ceramic Package Design|
|Keywords: ceramic, FEA, Weibull|
|Critical in the robust design of any multilayer ceramic package is the thermal expansion mismatch that takes place during brazing and/or soldering between the metal components and ceramic substrate. This general expansion mismatch produces residual thermal strain in the ceramic that, depending on the severity, can lead to premature component failure. In the present work, the finite element method (FEM) has been utilized as a convenient tool for investigating the design choices that minimize this effect. However, as with any computational tool, proper implementation of the technique must address a host of technical issues such as: i: Temperature dependent material property characterization. ii: Modeling assumptions such as isothermal behavior and stress relaxation. iii: Fine detail stress analysis resolution by implementation of submodeling technique. iv: Statistical nature of failure in brittle materials via CARES (Ceramics Analysis and Reliability Evaluation of Structures) design software. v: Experimental validation of results. These issues will be discussed in the broader context of HTCC and LTCC package design allowing the audience to gain a general understanding of the FEM and its application. It will also be emphasized how the finite element technique can be used to expedite the entire package design process thereby eliminating costly “build and test” scenarios.|
|Mark Eblen, R&D Program Manager
Kyocera America, Inc.
San Diego, CA