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Analysis of Pb-Free BGA Solder Joint Reliability Data
Keywords: reliability, Pb-free, solder joint fatigue
As the electronic industry has been focusing on eliminating lead (Pb) from the product manufacturing processes to meet the EU RoHS Directive, numerous studies on lead-free interconnect reliability have been published and more will be available to the public in the near future. Without looking at those available data as a whole, conflict conclusions may be drew from one set of data to the other. Therefore it is critical for packaging reliability engineers look retrospectively from time to time on what has been done and perform a statistical analysis on the available data see if any gaps need to be filled or any grounds have yet to be covered. The purpose of this study is perform such an analysis on current available Pb-Free package reliability data to sort out the most significant attributes and the critical areas that need to pay more attention on in the future. Based on more than 200 test data points from publications and internal qualification tests that cover a wide range of package types (FCBGA, PBGA, TBGA, etc), most commonly used lead-free solder compositions (SAC, SnAg, etc), and most industry standard accelerated test conditions, this analysis helps us to better understand how Pb-free solder joint behavior under different test conditions.
Weidong Xie, Manufacturing Engineer
Cisco Systems, Inc.
San Jose, CA

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