Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Newly Developed Low-Transmission-Loss Multilayer Materials for PWBs Applied to High GHz Bands|
|Keywords: Low loss laminate, High frequency PWB, Profile-free copper foil|
|The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave band to handle the growing volume of data. Signals on printed wiring boards (PWBs) used in these applications have come to adapt higher frequencies. At higher frequencies signal will attenuate more easily. It is getting important in high-frequency circuits to reduce the transmission loss on PWBs. We have newly developed low-transmission-loss multilayer materials suitable for PWBs applied to high GHz bands. The new laminates made with new resin system have good dielectric properties and show the same level of low dissipation factor as the PTFE laminates. The new laminate with our original profile-free copper foil is lower losses than that with VLP foils. These new laminates have proved to be reliable materials for good transmission. Moreover, they have high Tg, low moisture absorption, and good heat resistance suited for the lead-free soldering process.|
|Kenichi (Ken) Ikeda, Senior Researcher
Hitachi Chemical Co., Ltd.
Chikusei-shi, Ibaraki 308-8521,