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Modeling Residual Stresses in Epoxies during Cooling
Keywords: Optielectronic , Thermal, Adhesive
Epo-Tek 353ND adhesive is commonly used in optoelectronic packaging. The success of many optoelectronic packages depends upon the dimensional stability of the adhesive used. In this study, the viscoelastic of properties of Epo-Tek 353ND is characterized and the build-up of therm stresses upon cooling is modeled. Modeled thermal stresses are compared to measured thermal stresses and different approaches tho thermal stress modeling will be discussed.
S. Cimmerelli, Graduate Student
Lehigh University
Bethlehem, PA


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