Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Modeling Residual Stresses in Epoxies during Cooling|
|Keywords: Optielectronic , Thermal, Adhesive|
|Epo-Tek 353ND adhesive is commonly used in optoelectronic packaging. The success of many optoelectronic packages depends upon the dimensional stability of the adhesive used. In this study, the viscoelastic of properties of Epo-Tek 353ND is characterized and the build-up of therm stresses upon cooling is modeled. Modeled thermal stresses are compared to measured thermal stresses and different approaches tho thermal stress modeling will be discussed.|
|S. Cimmerelli, Graduate Student