Here is the abstract you requested from the IMAPS_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Novel Multi Chip Packaging Method Using Stochastic Self Assembly|
|Keywords: Flexible Electronics, RF micro sensors, Conductive printable inks|
|The objective of this project was to apply a self-assembly process in the development of a functional battery assisted passive (BAP) tag. A multifunctional sensor using RF signals was designed and fabricated. Multiple ASIC and OTS IC dies were placed in a multi layer flexible carrier by applying a self assembly method and packaged to archive inexpensive micro sensors. The interconnections were made using printable conductive inks to replace previously used thin film processes and to reduce costs. This flexible package consists of more than one polymer substrate with the devices embedded in it and connected to each other and are finally covered by polymeric planarization layers where the traces are printed on leading to the package terminal of the device.|
|Bernd Scholz, Research Engineer
Center for Nanoscale Science and Engineering, North Dakota State University