Here is the abstract you requested from the Printed_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Printing Silicon Integrated Circuits|
|Keywords: packaging, thin silicon, flexible|
|There is a strong market demand for electronic devices which comprise one or a small number (less than ~50) components in an integrated product package. RFID tags are the chief exemplar of the former, and wirelessly networked sensors are one of many examples of the latter. These products are still too expensive to be widely used in many cases, due both to fabrication and material costs. In addition, the preferred form factor is usually small, thin and flexible. We have developed a transfer printing process which addresses this need, and promises to allow facile, cost-effective packaging of such circuits both in ultrahigh volumes as well as moderate scale runs. The process is especially valuable for the handling of ultrasmall (e.g. less than 100 microns) and thin (less than 30 microns) components.|
|J. R. Sheats, CTO
WATERLOO, ONTARIO N2V 1B4,