Here is the abstract you requested from the Printed_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Inkjetted 3D Interconnections for Electronic Applications|
|Keywords: 3D printing, IC packaging, Die interconnection|
|The increasing demands in electronics packaging are driving the development of current packaging methods and encourage seeking for new manufacturing processes and packaging concepts. Printing processes, such as inkjet printing, have emerged as an alternative manufacturing method of electronics with a lot of potential. The variety of functional inks for electronics has increased significantly, and currently there are several companies that sell and develop functional inks that are specifically designed for printable electronics. There are available e.g. conductive, dielectric, and semiconductive inks, which means that basically complete electronic systems could be manufactured with a single inkjet printer by printing functional inks on a substrate. However, the transistors made with semiconductive inks have rather limited performance compared to their counterparts on a silicon wafer and the applications of fully printed devices are limited to only low-perfomance applications. Therefore, hybrid products are necessary, which combine both traditional components and printed devices. The attainable line widths with drop-on-demand inkjet are already at the same level than the conventional photolithography-based PCB process. Currently, line widths around 20 um line can be produced. This is in many cases sufficient for IC contacts and PCB wiring purposes. One main issue is the interconnections between a component, such as a silicon die or a discrete passive, and printed conductors. It is possible to create a wiring board after which components are attached onto it, but it is also possible to make new kind of design achitectures that the current methods does not enable. In this paper a 3D interconnections and direct attachment of a packaged component and a bare semiconductor chip are demonstrated. The method is interesting alternative to traditional methods, since the process does not need soldering phase. The method is applicable to both flexible and rigid substrates.|
|Matti Mäntysalo, Research Group Manager
Tampere University of Technology