Here is the abstract you requested from the Printed_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Polymer Nanocomposites, Printable and Flexible Technology for Electronic Packaging|
|Keywords: Polymer nanocomposites, Printable, Flexible|
|There has been increasing interest in the development of electronic circuits on flexible substrates to meet the growing demand for low-cost, large-area, flexible and lightweight devices, such as roll-up displays, e-papers, connectors, and keyboards. Organic/Polymer/Nanocomposite materials have attracted a lot of attention for building large-area, mechanically flexible electronic devices. These materials are widely pursued since they offer numerous advantages in terms of ease of processing, good compatibility with a variety of substrates, and great opportunity for structural modifications. Organic light-emitting diodes for flat-panel displays appear ready for mass production, and significant progress has also been made in organic thin-film transistors and solar cells. There is also a strong desire to develop new, large-scale advanced materials that can meet the growing demand for miniaturization, high-speed performance, and flexibility for microelectronic products. An effort in this direction is presented in this paper. This paper addresses the utilization of polymer nanocomposites as it relates to printable and flexible technology for electronic packaging. Printable technology such as screen-printing, ink-jet printing, and microcontact printing provides a fully-additive, non-contacting deposition method that is suitable for flexible production. The electronic applications of printable, high-performance nanocomposite mateirals such as adhesives (both conductive and non-conductive), interlayer dielectrics (low-k, low loss dielectrics), embedded passives (capacitors, resistors), circuits, etc. are discussed. Also addressed are investigations of printable optically/magnetically active nanocomposite and polymeric materials for fabrication of devices such as inductors, embedded lasers, and optical interconnects. Here a polymer matrix and a range of metal/ceramic fillers with particle size ranging from 10 nm to 10 microns have been used. Addition of different fillers into the polymer matrix controls the overall electrical properties of the composites. For example, addition of zinc oxide nanoparticles into the polymer shows laser-like behavior upon optical pumping, and addition of barium titanate (BaTiO3) nanoparticles results in high capacitance. The study also evaluates the suitability and capability of the inkjet printing technology for the manufacturing of high-performance electronics. A variety of ink-jet printable circuits and their stability under various printed wiring board and laminate chip carrier fabrication process will be presented. In addition, flexible packages for variety of applications are being developed. Several classes of flexible materials that can be used to form high-performance flexible packaging are discussed. A variety of materials, including polyimide, PTFE, liquid crystal polymer (LCP), has been used to develop flexible packages. Flexible packages with embedded passives are also being investigated. A key element of these flexible packages is incorporation of integrated decoupling capacitance/resistance layers. Use of nanomaterials to enhance the conductivity of electrically conductive pastes, form printable integrated resistors with controlled sheet resistance, and form capacitors with high capacitance density will be presented. Performance characteristics, including both electrical and mechanical behavior of circuits with various levels of complexity will be presented. Collectively, the results suggest that flexible and printable materials may be attractive for a range of applications, not only where flexibility is required, but also in large-area microelectronics such as radiofrequency structures, medical devices, etc.|
|Rabindra Das, Senior Advisory Technologist
Endicott Interconnect Technologies, Inc.