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Additive Inkjet Fabrication of 2.4Ghz Radio Tags used in Local Positioning
Keywords: electronics miniaturization, inkjet printing , local positioning
New technolgies are needed for electronics packaging and manufacturing to fulfill the future customer demands and environmental expectations of products. Digitally driven additive manufacturing using inkjet is a novel and flexible way to process electrical interconnections and devices allowing more efficient, straightforward and flexible compared subtractive masking processes, several time-consuming and expensive steps can be left off. In printed module concept conventional semiconductor components and passives, and other parts that are first embedded in encapsulant are interconnected using inkjettable nanoparticle ink and inkjettable dielectric material. Entire electronic system can be integrated in single part to form functional system or subsystem, i.e. System-in-Package (SiP). The interconnection and packaging is done at once for all components in module. Printed module concept was applied to miniaturize a 2.4 GHz short range radio transmitter used in direction-of-Arrival (DoA) -based local positioning system. The transmitter tag can be used for finding and locating people, keys, wallet, or virtually anything in which the tag can be attached. The tag can be located by using antenna array equipped mobile phone running positioning application, or using a positioning system utilizing ceiling mounted antenna arrays. In such application miniature size and high performance are important. The number of commercial applications and location based services using indoor positioning is expected to rise. There are already several local positioning applications present today used in hospitals, warehouses, and public safety. A prototype of radio tag used in local positioning purpose was designed and a small serie of tags was manufactured using additive inkjet process. Considerable reduction in circuit area was obtained using inkjet integration process. The module consisted of two bare die components, in which the minimum pitch was 100 m, and several discrete passive components. There were two conductive layers and three dielectric layers used to interconnect the components together.
Jani Miettinen, Research Scientist, M. Sc.
Tampere University of Technology
Tampere 33720,

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