Abstract Preview

Here is the abstract you requested from the Printed_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Utilization of Selective Patterning for Inkjet Printing in the Electronics Manufacturing
Keywords: Inkjet printing , Substrate modification, Selective patterning
To fully utilize inkjet printing in the manufacturing of electronics an accurate patterning method is required. A high-density circuitry made by inkjet printing can be used for example in the patterning of interconnections, in the component attachment, and for the printing of basic electronic components. Currently, inkjet technologies used in electronics manufacturing typically employs 10pl printheads. It means that line widths between 30-100 µm are possible to achieve. However, due to the binary nature of the process a printed line has variations in width (inhomogeneous edges). To improve the ink-jetted lines, substrate modifications can allow better control of ink deposits enabling printing of more precise, thin and sharp lines, and smaller devices. The benefits of this are obvious for devices using high frequencies. One method to modify the substrate is the approach of creating a hydrophilic/hydrophobic pattern on the surface, and to print the ink droplet at the hydrophilic/hydrophobic edge. As a result, all the ink will be elongated on the hydrophilic side. The strategy is to first print a hydrophobic layer on a hydrophilic substrate and thereafter print the functional ink on top of the pattern with hydrophilic lines of suitable width. The method of this selective patterning can be tested for the printing of various high-density circuitries.
Jian Lin, Postdoctoral Researcher
bo Akademi University
Turku FI-20500,

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic