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2-D Packing Graphical Simulation for High Conductive Nano Paste
Keywords: 2-D Packing, Conductive Paste, Void Volume
For small and flexible electronics appliances, conductivity of nano ink is crucial. Reducing the void volume by putting maximum quantity of particles in bulky state is important for high conductive nano paste. Mono-dispersed nano size particles were used to make conductive pattern without leading clogging in general ink jetting process. The conductivity of jetting ink were reported 35%. In this work, to minimize the void in particle packing system, two dimensional (2-D) graphical computer simulation was developed with the variables of particle sizes and fractional volumes. The randomize method in 2-D computer simulation is designed particle.
Dong Hoon Oh, Assistant Researcher/ MS Student
SeoKyeong University, KEN Research Center
Seoul 136-704,
South Korea

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic