Here is the abstract you requested from the Printed_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Evaluation of Carbon Nanotube Filled Electrically Conductive Adhesives on Sn, Ag and Au Surface Finishes|
|Keywords: electrically conductive adhesive, carbon nanotube, lead free surface finish|
|Electrically conductive adhesives are a viable alternative to soldering and die attach in electronic assemblies. We are investigating the use of multiwall carbon nanotubes as filler particles in epoxy to produce adhesives with suitable electrical, mechanical and rheological properties. Progress to date has included comparison of various nanotube loadings in different epoxy resins. Current research is focused on compatibility of the adhesives with lead free printed circuit board surface finishes such as gold, silver and tin. Initial results show high mechanical strength in lap shear testing, and improved mechanical and electrical properties with addition of viscosity modifiers. The primary challenge remaining is contact resistance.|
|Janet K. Lumpp, Associate Professor
University of Kentucky