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Evaluation of Carbon Nanotube Filled Electrically Conductive Adhesives on Sn, Ag and Au Surface Finishes
Keywords: electrically conductive adhesive, carbon nanotube, lead free surface finish
Electrically conductive adhesives are a viable alternative to soldering and die attach in electronic assemblies. We are investigating the use of multiwall carbon nanotubes as filler particles in epoxy to produce adhesives with suitable electrical, mechanical and rheological properties. Progress to date has included comparison of various nanotube loadings in different epoxy resins. Current research is focused on compatibility of the adhesives with lead free printed circuit board surface finishes such as gold, silver and tin. Initial results show high mechanical strength in lap shear testing, and improved mechanical and electrical properties with addition of viscosity modifiers. The primary challenge remaining is contact resistance.
Janet K. Lumpp, Associate Professor
University of Kentucky
Lexington, KY

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