Here is the abstract you requested from the Printed_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A 3D Sensor Fabricated by Layer-Based Additive Manufacturing and Printed Interconnect|
|Keywords: Layer-based Addititive Manufacturing, Printed Interconnect, 3D Sensors|
|Traditional electronics have generally been constrained to two dimensions. Fully three dimensional off-axis component placement and routing have only recently been explored with monolithic substrates. Solid freeform fabrication provides the means of creating a dielectric substrate of any arbitrary and complex shape suitable for these electronics including sockets for components. Direct Print dispensing of conductive inks or epoxies onto these substrates has been reported previously for electronics applications, but was generally confined to two dimensions in a fashion similar to traditional electronics. This paper describes a demonstration prototype of a 3D magnetometer sensor with micro-controller in a single 3D substrate.|
|Eric MacDonald, Assistant Professor
University of Texas at El Paso
El Paso, TX