Micross

Abstract Preview

Here is the abstract you requested from the rf_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Advanced Materials Solutions For Thermal Management Design: Metallized Pyrolytic Graphite Structures
Keywords: thermal management, materials, packaging
Recent Materials Science forums have focused on carbon nanotubes as an advanced material for thermal management. While carbon nanotubes might offer an intriguing potential for enhanced thermal management performance in the future, it currently is restricted to demonstration-scale activities. However, current technology of a different carbon polymorph, pyrolytic graphite, offers the opportunity for superior thermal management in commercial applications. Advances in metallization technology of pyrolytic graphite 3-dimensional structures will be discussed with evidence of suitable bond adhesion enabling direct soldering to electronic devices. This metallization technology allows for an engineered, lightweight heat spreader with thermal characteristics approaching diamond but with a modulus of elasticity more suitable for the severe thermal cycling requirements of advanced electronics packaging. This paper will review materials characteristics, demonstrate 3D application finite element model efficiency and offer practical slutions to the incresingly difficult thermal management environment.
Robert J. Moskaitis, Ph.D., Technical Director
MINTEQ International Inc./PYROGENICS Group
Easton, PA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems