Micross

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Fundamentals of Highly Integrated Co-Fired Packaging
Keywords: Co-Fired Substrate, Microwave Packaging, RF Packaging
Co-fired ceramic packaging has well established applications in high speed digital and microwave circuits. The package materials inherently provide high performance and the ability to protect bare die through hermetic sealing. Very highly integrated packages have been developed as this technology has matured but fundamental guidelines on their design does not exist in the literature. The purpose of this paper is to document the fundamental trades and design principles associated with performing a highly integrated multi-layer co-fired package design.
Dan Harris, Lead Member of the Engineering Staff
Lockheed Martin
Moorestown, NJ


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