Micross

Abstract Preview

Here is the abstract you requested from the rf_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Extraction of Dielectric Constant and Loss Tangent of Microwave Substrates using Full Sheet Resonance Method
Keywords: dielectric constant , loss tangent, electrical characterization
The materials properties of printed circuit board dielectrics is needed by designers working in various areas such as signal integrity, power integrity, antennas, and embedded RF components. The dielectric constant and loss tangent vary as a function of frequency, and are related by the Kronig- Kramers relations. Among many methods to extract the materials properties, the full-sheet resonance technique (Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates, IPC-TM-650, 2.5.5.6, The Institute for Interconnecting and Packaging Electronic Circuits Std., May 1989) is commonly used on printed circuit boards due to its simplicity. The disadvantage of this method is that an analytical equation is used to extract the dielectric constant, which is accurate only for lossless dielectrics. In this presentation, a new method is introduced to solve the inaccuracy issue of the extraction of dielectric constant by applying customized electromagnetic simulation based on a new rapid plane solver instead of analytical equations. The new method is applied on a standard FR-4 substrate and a low-loss dielectric, Rogers RO4003C, up to 20 GHz. Both dielectric constant and loss tangent is extracted as a function of frequency. The extracted results are then compared against the standard full-sheet resonance method. This new method has the simplicity of the standard method, whereas the accuracy is significantly improved for low loss RF/microwave substrates.
A. Ege Engin, Assistant Professor
San Diego State University
San Diego, CA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems