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Transient Liquid Phase Sintering Adhesives for Radar T/R Module Thermal Management
Keywords: sintering, die-attach, thermal conductivity
Continuous improvements in wide bandgap (WBG) semiconductor components and materials have dictated the need for very-high thermal conductivity and cost-effective die-attach materials for device-level thermal management. Conductive adhesives are typically used for low]cost assembly, but these materials represent the weakest point in the thermal path. To address this issue, we present an innovative die-attach technology based on transient liquid phase sintered (TLPS) adhesives that form metallurgical bonds with solderable surfaces. TLPS materials can provide an order of magnitude or better thermal performance than existing adhesive technologies. These low-viscosity, solvent-free and reworkable materials are processed like adhesives but provide the electrical and thermal performance of solders. Lead-free TLPS has demonstrated effective thermal conductivity in excess of 15 W/m-K and volume resistivity below 75 Ohm-cm at a bond-line thickness under 2 mils (< 50 m). For RoHS exempt applications, TLPS formulations have demonstrated effective thermal conductivity in excess of 40 W/m-K. Material level characterization reveals robust bonds and stable thermal/electrical performance after accelerated aging. The high conductivity and reworkable nature of TLPS materials enables direct die-attach of WBG devices, eliminating the need for gold-tin eutectic solder as well as heat-spreading shims. TLPS materials are designed as drop]in replacements for existing manufacturing processes and are a cost-effective alternative to solders and conductive adhesives in a wide variety of electronics applications. In this paper we will present the results of preliminary MIL-STD 883 accelerated aging studies of TLPS for radar T/R modules.
Matthew Wrosch, Vice President, Business Development
Creative Electron, Inc.
San Marcos, CA


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