Here is the abstract you requested from the rf_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Bridging the Manufacturing Gap Between Macro and Micro to Build Packaging for Miniature RF Devices with Complex Geometries and Multiple Materials|
|Keywords: Sensors, Energy, Miniature|
|Materials scientist and entrepreneur, Arthur L. Chait will show why there is a manufacturing gap when building miniature RF devices, with complex geometries and multiple materials. He will describe how MEMs and related methods work well with a single material like silicon and how some techniques can handle two materials. Yet there are innovative designs for miniature RF devices larger than nano yet too small to be practical or cost effective for machining, assembly and automation. This lecture will provide a better understanding of the requirements of manufacturing small devices that generate, harvest and manage energy. Mr. Chait will share to examples of these small devices. These include energy harvesters that power tire pressure sensors and NOX sensors in automobiles. He will explain one solution, a forming method that allows metals, ceramics, polymers and void spaces to be designed into one part, with thousands of parts made at the same time. This print deposition technique relies on proprietary “inks” or pastes that decompose when heat treated to leave behind compatible dielectrics, conductors and open spaces. These three-dimensional parts can contain hundreds of layers with thicknesses that range from microns to millimeters. Mr. Chait will reveal some of the major challenges that have to be resolved in order for this platform technology to be successful. The deposition “inks” or “pastes” must print precisely-defined shapes They must hold high tolerances through hundreds of layers. They much cure quickly without shrinkage to accommodate layer buildup. They must bond to other materials where needed and not bond where required. They must allow binder removal with no residue or stress. They must yield high-density materials through heat treatment and must achieve specific properties for conductivity and dielectric constant.|
|Arthur L. Chait, President and CEO
EoPlex Technologies, Inc.
Redwood City, CA