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Advanced TPG Material for the Thermal Management of Electronics
Keywords: Thermal Management, Thermal Pyrolitic Graphite, RF Packaging
The continuous demand on higher chip power dissipations and shrinking device footprints require innovative thermal management solutions, including materials and cooling technologies. Momentive Performance Materials manufactures a specialty thermal material, Thermal Pyrolitic Graphite (TPG*), which exhibits thermal conductivity greater than 1550W/mK. TC1050* is a composite material Momentive developed to encapsulate TPG* in metal, polymer, and other materials which enables it to be used in heat spreaders, heat sinks, and other thermal management products. In this talk, the characteristics of TPG and TC1050 will be presented. Experimental data from TC1050 applications will also be discussed.
Xiang (Shawn) Liu , Application Development Engineer
Momentive Performance Materials
Strongsville, OH

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