Here is the abstract you requested from the rf_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Development of Super Copper Tungsten|
|Keywords: Thermal Management, Copper Tungsten, RF Packaging|
|Copper tungsten as a heat sink material has been around for a long time. There are not many new developments. The main properties like thermal conductivity have reached a stable point (like ~200 W/mK for Cu15W85). Inspired by the thermal via design in multilayer ceramic technology, our team sets out to develop to a new generation of copper tungsten which has at least 10% improvement in thermal conductivity over traditional copper tungsten. We named it super copper tungsten. In this presentation, we will cover the basic construction of super copper tungsten (with vertical and horizontal copper vias), experiments and results. Using simulation, we will also investigate the possibility of optimizing the thermal conductivity and CTE by varying the via sizes/density.|
|Ken Kuang, President
Torrey Hills Technologies, LLC
San Diego, CA