Micross

Abstract Preview

Here is the abstract you requested from the rf_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Materials Declaration for Semiconductor Packages
Keywords: RoHS/REACH Compliance, Materials Declaration, RFIC Semiconductor Analysis
Regulatory and market developments in the electronic industry, such as the EU directives on RoHS and WEEE, require that each member of the supply chain understand the substance and material composition of the bulk materials, components, subassemblies etc. which make up the final product. In response to this , customers are requiring their suppliers to produce material declarations at the homogenous level. For companies supporting global customers this can be a big challenge as regulations, formats and requirements differ in various geographic locations. This paper summarizes some of the challenges encountered in completing materials declarations for semiconductor packages such as RF ICs. The paper also provides some insight into the US industry standardization efforts using IPC 175X format and its applications in materials declaration.
Mumtaz Y. Bora, Senior Quality Engineer
Peregrine Semiconductors
San Diego, CA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems