Abstract Preview

Here is the abstract you requested from the rf_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

A Low Power CMOS 60GHz Transceiver with LTCC On-Package Patch Antenna
Keywords: 60GHz CMOS Transceiver, LTCC Packaging, On-package antenna
This paper presents a low power 60GHz transceiver which includes RF, LO, PLL and BB integrated into a single chip and has been packaged into an LTCC package with integrated antennas. The transceiver has been fabricated in a standard 90nm CMOS process and includes ESD protection on all pads include those carrying mm-wave signals. With a 1.2V supply, the chip consumes 170mW while transmitting (+10dBm) and 138mW while receiving. Using on-wafer probing, data transmission up to 5Gbps on each of I and Q channels has been measured, as has data reception over a 1m wireless link at 4Gbps QPSK with less than 1E-11 BER. We plan to perform similar measurements in the package. The die has been integrated into the LTCC package using flip-chip solder bumps. The LTCC package houses a 16-element patch antenna array to achieve directional gain with good efficiency. Microstrip-based low-loss feedlines have been used to connect the PA/LNA output/input to the antenna array.
Maryam Tabesh, Graduate Student Researcher
UC Berkeley & Technical Research Centre of Finland (VTT)
Berkeley, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic