Here is the abstract you requested from the Thermal_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thin Film Thermoelectric Heat Pump Chip Cooler|
|Keywords: thermoelectric , heat, pump|
|It is well known that dissimilar metals when connected electrically can be made to produce hot and cold regions by supplying the completed junctions with current. A preliminary compact thin film design will be shown and discussed in this paper. The application would be for thermal management of computer chips or any other heat generating IC that would benefit from having its heat dumped remotely. Properly designed, the scheme would be efficient and would not require heavy real estate costs on the board. Made with modern lithographic techniques employed in the electronics industry the method could be done at small scale.|
|John Archibald, V. P. of Engineering
Northfield Engineering Company