Here is the abstract you requested from the Thermal_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A Highly Thermally Conductive No Pump-Out Grease: Properties and Applications|
|Keywords: Thermal interface material, Thermal grease, No pump-out grease|
|The industry trend toward reduced feature size and faster operating speed has generated demands for higher powered devices. The increased power and reduced overall area creates higher thermal loads for the package. This has led to the needs for new thermal materials with high thermal conductivity. High performance thermal interface greases, gels and adhesives significantly improve the transmission of the heat generated by the high power densities out of the system. Thermal greases generally have higher thermal conductivity than gels or adhesives with similar fillers. Unfortunately, greases typically pump-out and separate during use. Additionally, some applications that require higher thermal conductivity materials can not go through a cure profile normally used for non-grease TIMs. LORD has developed a thermal grease with properties that dramatically exceed traditional thermal greases. This material has thermal conductivity values as high as 8W/mK and thermal resistance values as low as 3 mm2K/W. In addition, LORD’s new thermal grease will never bleed or pump out, eliminating the reliability problem most commonly encountered with traditional thermal greases. The innovative technology used to develop this material helps engineers solve complex fundamental thermal management problems by allowing the use of high performance thermal greases in applications previously restricted to lower thermally conductive materials, such as, gels or adhesives.|
|Sara N. Paisner, Staff Scientist