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System Package Embedded Active Liquid Cooling using 3D-MID Technology (Molded Interconnect Devices)
Keywords: Thermal Management, Molded Interconnect Device, Liquid Cooling
The ongoing miniaturization of the semiconductor technology requires new and improved packaging solutions. Especially in electronic packaging thermal management becomes important with shrinking structures and increasing power densities. Three dimensional molded interconnect devices already proved the capability of intelligent packaging and system miniaturization. Besides electrical circuits various other functions including shape adjustment (medical), mechanical support or optical subsystems can be integrated directly. This paper presents the fabrication of an active heat sink embedded in a 3D-MID circuit carrier. The heat sink part of the 3D-MID consists of buried fluid channels fabricated by 1-shot polymer injection molding. DI Water is pumped through the buried channels to absorb heat. Power devices can be mounted directly on the 3D-MID surface over the buried channels. Due to insufficient thermal conductivity of the polymer, copper coated thermal vias connect the cannels with the respective power devices. Those vias are created by laser drilling. The metallization of the 3D-MID circuits and the vias is done by electroless deposition of Cu followed be an ENIG finish to improve corrosion resistance. To prove the function of the heat sink a power LED is mounted on the 3D-MID. The thermal contact of the LED is directly soldered to the thermal vias resulting in a minimized thermal resistance between LED and thermal vias. FEM simulations have been performed to estimate the thermal environment and specify the optimal geometrical distribution of the thermal vias. Temperature measurements of the power LED are performed with and without water cooled channels to show the improved thermal management of the 3D-MID. In summary the developed MID system can cool power devices without extra heat spreaders or heat sinks. It is even possible to mount several power devices in array structures since the heat flow is not spread in area.
Thomas Leneke, Student
TEPROSA - Otto-von-Guericke-University Magdeburg
Magdeburg, Sachsen-Anhalt 39106,

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